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GL系列
The GL sensor family from Gpixel comprises a wide range of horizontal resolutions, ranging from 2k to 16k, with line rates of up to 200 kHz. These sensors feature pixel sizes of 3.5 µm, 5 µm, 7 µm, and 14 µm, providing a comprehensive selection to suit diverse line scan applications.
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Global Shutter
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TDI
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GLT5016BSI
16k BSI TDI (TIME DELAY INTEGRATION) LINE SCAN IMAGE SENSOR
GLT5016BSI is a Backside illuminated (BSI), Time delay integration (TDI), charge domain CMOS image sensor with 5μm pixels and 16416 effective resolutions. The sensor has two photosensitive bands, 256 stages and 32 stages respectively enabling a high dynamic range (HDR) imaging mode, which is designed to meet the needs of high speed and low light applications by maximizing sensitivity with state-of-art BSI scientific CMOS technology. GLT5016BSI Sensor integrates an on-chip sequencer, supports channel multiplexing and selectable 2 scan directions (Forward and Reverse). It is assembled in a 415-pin μPGA ceramic package for reliability and good heat dissipation. GLT5016BSI comes in 2 spectrum variants: an UV-optimized with high QE below 300 nm and a visible and NIR range optimized version.
  • Key features and Benefits

    True charge domain Time Delay Integration

    Back Side Illuminated (BSI) pixels

    High Sensitivity with QE of 70.7% @ 266 nm (UV Version) and up to 92.4 % @ 440 nm (VIS version)

    High Speed: up to 500 kHz

    HDR read out

    On-chip binning
  • Package Drawing
  • QE Curve
GLT5016BSI
GLT5016BSI
产品指标

  • Resolution

    16.4K

    Nr of Active Pixels

    P1: 16416 pixels x 256 stages P2: 16416 pixels x 32 stages

  • Optical format

    82.02 mm

    Pixel size

    5 μm x 5 μm

  • Full well capacity

    15.2 ke‾

    Temporal noise

    7.5 e‾

  • Dynamic Range

    66.1 dB

    Max Line Rate

    500 kHz

  • Peak QE

    UV version - 70.7% @ 266 nm - 87.8% @ 420 nm, VIS version - 92.4% @ 436 nm - 87.0% @ 590 nm

    Shutter type

    Time Delay Integration

  • Parasitic Light Sensitivity

    -

    Photosensive area

    P1: 82.08 mm × 1.28 mm, P2: 82.08 mm × 0.16 mm

  • Angular response

    -

    Dark Current

    0.97 ke‾/pix/sec @ 15℃

  • Max. SNR

    41.7 dB

    ADC

    12 bit

  • Output format

    108 ch Sub-LVDS

    Channel multiplexing

    108/96/72/48/36/24/12

  • Max. Data rate

    103.68 Gbps

    Chroma

    Mono

  • Power consumption

    < 6.6 W

    Supply voltage

    3.3 V (analog), 1.65 V (ADC), 1.6 V (digital)

  • Package

    μPGA 415 pins (98.08 mm x 19.00 mm)

    Availability

    Engineering Samples (ES)

产品编码
  • GLT5016BSI-ABM-NUN-BUE
    VIS version. 415-pin μPGA package. Sealed D263® Teco glass lid with AR coating on both sides. ES
  • GLT5016BSI-AUM-NUN-BRE
    UV version. 415-pin μPGA package. Removable D263® Teco glass lid with AR coating on both sides. ES
  • GLT5016BSI-ABM-NUN-BUD
    VIS version. 415-pin μPGA package. Sealed D263® Teco glass lid with AR coating on both sides. Demo grade
  • GLT5016BSI-AUM-NUN-BRD
    UV version. 415-pin μPGA package. Removable D263® Teco glass lid with AR coating on both sides. Demo grade
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