August 14, 2024, Changchun, China – Gpixel announces the GLT5009BSI-DUV image sensor optimized for sensitivity in the deep ultraviolet (DUV) portion of the spectrum to support semiconductor inspection. Based on GLT5009BSI, a high-speed 9k backside illuminated CMOS image sensor with 5 µm square pixels and true charge-domain time delay and integration (TDI) operation for increased sensitivity, is the DUV version developed with an optimized antireflection coating to achieve >50% quantum efficiency at 266 nm and >30% at 200 nm [WW1] while still maintaining a peak in the visible >70%.

Fig. 1 The GLT5009BSI-DUV is a 9k TDI sensor with two bands of 256 stages and 32 stages each, operating at 600 kHz in 10-bit mode.

The GLT5009BSI-DUV has two 9072-pixel photosensitive bands of 256 stages and 32 stages respectively enabling a high dynamic range (HDR) imaging mode. The sensor’s 5 µm pixel provides a full well capacity of 16 ke^- and noise level of 6 e^-, delivering more than 68 dB dynamic range in 12-bit mode at 300 kHz line rate. In 10-bit mode the sensor operates at over 600 kHz line rate and delivers 63 dB. Separate outputs from each band can be combined off-chip to achieve an extended dynamic range of 71.9 dB. Read out of the image data is achieved through 84 pairs of sub-LVDS channels at a combined maximum data rate of 74.3 Gbps. The TDI bands achieve charge transfer efficiency ≥0.99993 at full speed, and binning in the scan direction can be performed without any reduction in line rate. In addition, antiblooming performance >100x ensures artifact-free dark field inspections.

Fig. 2 QE of GLT5009BSI-DUV TDI image sensor (red curve) achieving a max 61% QE at 248 nm in DUV range vs standard GLT5009BSI (blue curve).  

The length of the photosensitive area is 45.36 mm and the sensor is assembled in a 269 pin µPGA package with removable glass. Several features ease camera integration including an internal sequencer, channel multiplexing, on-chip analog temperature sensor, and selectable scan direction. The GLT5009BSI-DUV is pin and footprint compatible with Gpixel’s existing 9k TDI image sensor.

“This new TDI image sensor addresses the growing demand for DUV imaging in the semiconductor inspection industry,” says Wim Wuyts, CCO of Gpixel, “and adds to our expanding portfolio of image sensor products with high UV sensitivity further strengthening our leadership position in the high-end imaging application field.”

The GLT family of high-end TDI image sensors combines high speed and sensitivity from UV to NIR making it ideal for applications such as flat panel display inspection, printed circuit board inspection, wafer inspection, digital pathology and fluorescence imaging. Engineering samples and evaluation hardware for the GLT5009BSI-DUV are available today.

For more information about the GLT5009BSI-DUV, an overview of upcoming TDI image sensors, and a summary of available UV-sensitive image sensors, please contact info@gpixel.com.

About Gpixel
Gpixel is an international company providing high-end customized and off the-shelf CMOS image sensor solutions for industrial, medical, scientific, and professional imaging applications. Gpixel’s standard products include the GMAX and GSPRINT global shutter, fast frame rate sensors, the GSENSE high-end scientific CMOS image sensor series, the GLUX series of high sensitivity sensors for surveillance, the GL series of line scan imagers, the GLT series of TDI imagers, the GLR series of sensors with rectangular pixels for displacement sensors and spectroscopy, and the GCINE series of sensors for professional video and photography. Gpixel provides a broad portfolio of products leveraging the latest technologies to meet the ever-growing demands of the professional imaging market.